Toshiba Introduces Industry's First HDMI(R) to MIPI(R) DSI Converter IC

Toshiba Corporation (TOKYO:6502) today announced that it has launched "TC358779XBG", the industry’s first1 High Definition Multimedia Interface (HDMI®) to MIPI® Display Serial Interface (DSI) bridge IC for consumer and industrial applications that use small form-factor LCD displays. Samples are now available, with mass production scheduled to start in December this year.

The “TC358779XBG” converts HDMI® video input and outputs it as a MIPI® DSI video stream output. This will promote adoption of MIPI®-compliant small form-factor LCD displays in applications that include game accessories, wearable computers and head-mounted products.

The product also integrates video preprocessing functions—video de-interlacing, scaling and format conversion—and supports multiple audio interfaces, including the I2S, TDM, S/PDIF and MIPI® Serial Low-power Inter-chip Media Bus (SLIMbus®) audio formats.

Key Features of New Product

1. The industry’s first device that converts HDMI® video input and outputs it as a MIPI® DSI video stream.

2. Integrated video de-interlacing, scaling and format conversion contribute to lower memory bandwidth and video processing requirements on host processors.

3. HDMI® 1.4 RX support

- Up to 1080P @ 60fps video format (RGB, YCbCr444: 24-bpp, YCbCr422 24-bpp)

- HDCP 1.3

- 3D support

4. Available in any of the four audio interfaces: I2S, TDM, SPDIF or SLIMbus®

5. Maximum 1Gbps/lane link speed MIPI® DSI interface

6. Maximum 165MHz clock speed HDMI® interface

Applications

A wide range of consumer electronics and industrial applications, including mobile devices, digital cameras and gaming accessories, head-mounted products and other wearable computers.

Main Specifications

Part Number TC358779XBG

Input Interface HDMI® 1.4

Max. clock speed 165MHz

Output Video Interface MIPI® DSI 4 Data lanes (Up to 1Gbps/lane)

Output Audio Interface I2S, TDM, SPDIF or SLIMbus®

Source Voltage MIPI®/Core/PLL: 1.2V

HDMI®: 3.3V

I/O: 1.8V to 3.3V

Package FPGA80 (7mm x 7mm, 0.65mm pitch)

Mass Production Schedule December, 2013